Hordhac si toos ah loo yaqaan 'Toog' Tooska Tooska ah

Habka diyaarinta ee substrate-ka DPC dhoofinta waxaa lagu muujiyey shaxanka. Marka hore, laser waxaa loo isticmaalaa in lagu diyaariyo godad ku yaal sunta substrate ee madhan Tiknoolajiyadda 'magnettron' oo lagu dumiyo tikniyoolajiyadda lagu shubo oo birta lagu shubo dusha sare ee dusha sare ee dusha sare ee dhoobada. Lakabka abuur (ti / cu), ka dibna buuxi wax soo saarka lakabka wareegga iyada oo loo marayo sawir-qaadyo iyo horumar; U adeegso korantada si aad u buuxiso godadka oo aad u yareyso lakabka birta ah, oo aad u hagaajiso caabbinta dhiigga iyo caabbinta oks-ka ah ee ku saabsan dawada, oo ugu dambeyntiina ka saar lakabka qallajinta, lakabka abuurka si aad u buuxiso diyaarinta abuurka.

Dhamaadka hore ee diyaarinta sunta 'DPC dhoofinta' DPC Clamenc 'waxay qaadataa tikniyoolajiyada micromarin-ka ee semicomachoring (caqabad ku dheji, iyo dhabarka, iyo dhabarka plaction), buuxinta, buuxinta goynta, dusha sare, dusha, dusha, dusha, dusha sare. Ka shaqeynta, iwm.), Faa'iidooyinka farsamada ayaa iska cad.

Astaamaha gaarka ah waxaa ka mid ah:

(1) Adeegsiga tikniyoolajiyada 'TecmoMactor', khadadka birta ee ku yaal sunta substrate-ka ee 'Cloumic' waa Functrate-ka 'Cloumic-ka' waa kuwa ugu fiican (ballaca ballaca / μm ~ oo ay la xiriirto dhumucda lakabka wareega), sidaa darteed DPC Substrate waxay aad ugu habboon tahay si loo habeeyo saxnaanta saxda ah ee aaladda aaladda microelktonic-ka oo ay ku jiraan baahiyo sare;

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(3) dhumucda lakabka wareegga waxaa xukuma koritaanka koritaanka koritaanka (guud ahaan 10 μm), iyo sagxadda dusha sare ee lakabka wareegga ayaa hoos loo dhigay si loo buuxiyo shuruudaha baakadaha ee heerkulka sare iyo aaladaha hadda socda;

(4) Nidaamka diyaarinta heerkulka ee hooseeya (ka hooseeya 300 ° C) ayaa ka fogaanaya waxyeelada xun ee heerkulka sare ee agabyada sunta ah iyo lakabyada fiilooyinka birta, iyo sidoo kale waxay yareysaa kharashaadka wax soo saarka. Isku soo wada duuboo, substrate-ka DPC waxay leedahay astaamaha saxsanaanta sawirrada sareeya iyo isku xirka toosan, oo waa sunta pcb-ga dhabta ah ee muhaajiriinta ah.

Si kastaba ha noqotee, substrates DPC sidoo kale waxay leedahay wax qabadyo:

(1) Lakabka birta ee birta waxaa diyaariyey geedi socodka korantada, oo sababa wasakhowga deegaanka ee weyn;

(2) Heerka koritaanka koritaanka koritaanka koritaanka koritaanka ayaa hoos u dhaca, iyo dhumucda lakabka wareegga waa mid xadidan (guud ahaan lagu xakameeyay 10 μm ~ 100 μm), oo ay adag tahay in la daboolo baahiyaha shuruudaha badan ee korantada ee hadda jira ee PAC-da ee hadda jira .

Waqtigan xaadirka ah, substratic-ka DPC dhoofinta waxaa badanaa loo isticmaalaa baakado awood sare leh.